Our 36th Annual Electronics Packaging will be held in-person this year at GE Aerospace Research Campus in Niskayuna NY.
Here are the confirmed speakers for our 2025 Electronics Packaging Symposium. This page will fill up with speakers and session chairs as they are confirmed.
Session Chairs and Speakers
Session 0: Keynote Speakers - (Benson Chan)
Speaker: Amanda K Petford-Long (Argonne National Laboratory)
Title: Argonne National Laboratory’s Microelectronics Research
Speaker: Mark Schultz (IBM)
Title: Argonne National Laboratory’s Microelectronics Research
Speaker: Eric Forsythe (CHIPS Office)
Title: Digital Twins for Advanced Manufacturing: Accelerating Advanced Package Innovation
Session 1: Heterogeneous Integration – Sathya Raghavan & Aakrati Jain (IBM), Gamal Refai-Ahmed (AMD)
Speaker: Manuela Junghähnel (Fraunhofer IZM)
Title: Modular interposer architecture providing scalable heat removal, power delivery, and communication
Speaker: Chuck Woychik (nHanced Semiconductor)
Title: The Future of Electronics Packaging: Chiplet Architecture and AI Defect Inspection
Speaker: Chris Bower (XDisplay)
Title: Heterogeneous Integration of Microscale Light Emitters and CMOS Chiplets Using Elastomer Stamp Mass Transfer
Session 2: Photonics Packaging – John Mazurowski (Penn State Optical Lab), Colin McDonough (AIM)
Speaker: David Harame (AIM Photonics)
Title: Co-Process and Co-Design for Co-packaged Optics
Speaker: Koushik Ramachandran (Global Foundries)
Title: Photonic Packaging: Path to High Volume Manufacturing
Speaker:
Title:
Session 3: mmWave and 5G Packaging – Jason Case (GE Aerospace)
Speaker: Genaro Soto Valle (Georgia Tech)
Title: Zero-Power Additively Manufactured FHE-Enabled Wireless/5G+ Ultrabroadband Modules for IoT, SmartAg, Industry 4.0 and Smart Cities Applications: from dream to reality
Speaker: Michael Holyoak (Bell Labs / Nokia)
Title:
Speaker:
Title:
Session 4: Flexible, Wearable and Additive Electronics – Felippe Pavinatto (GE Aerospace). Mark Poliks (ÑÇÖÞÇéÉ«)
Speaker: Denis Cornier (Rochester Institute of Technology, AMPrint Center)
Title: Additive Printed Electronics Using Molten Metal Droplet Jetting
Speaker: Christine Kallmayer (Fraunhofer IZM)
Title: Stretchable Electronics - Smart Patches for Wound Monitoring
Speaker: Michael A Cullinan (UT Austin)
Title: Micro and Nanoscale Additive Manufacturing for Electronics Packaging Applications
Session 5: Power Electronics / Harsh Environments – David Shaddock (GE), Xaioling Li (NREL)
Speaker: Alan Mantooth (U Arkansas)
Title: Medium-Voltage Power Module in Data Center Applications
Speaker: Jong Eun Ryu (North Carolina State University)
Title: Digital Twin for Reliability and Life Prediction in SiC Power Electronics
Speaker: Fang Lou (Stonybrook University)
Title:
Session 6: Future of Computing for HPC / AI
Speaker: Clint Schow (UC Santa Barbara)
Title: Low-Power Coherent Optics to Enable Reconfigurable Networks in AI Systems
Speaker: Vikas Gupta (Global Foundries)
Title:
Speaker: John Knickerbocker (IBM)
Title:
Session 7: Substrates, Platform for Advanced Packaging – Shelby Nelson (Mosaic), Sean Garner (Corning)
Speaker: Erik Jung (Fraunhofer IZM)
Title: Evolution of advanced substrate technology: The shifts towards glass as core material
Speaker: Robert Schaut (Corning)
Title:
Speaker: Dan Turpuseema (Advantest Interconnect Solutions)
Title: Organic Substrate Fabrication for Fine Pitch Wafer Probing and Advanced Packaging
Session 8: Thermal Challenges - Ramchandra Kotecha (GE Aerospace) / Srikanth Rangarajan (ÑÇÖÞÇéÉ«)
Speaker: Srikanth Rangarajan (ÑÇÖÞÇéÉ«)
Title: AI for energy efficient electronic systems
Speaker: Theodorian Borca-Tasciuc (RPI)
Title: Thermal conductivity metrology of thin films for electronic applications
Speaker: Emad Andarawis (GE Aerospace)
Title: Robust Multilevel Die Interconnect for 600°C Operation